Manufacture of an AI server, by component
Nvidia HGX H100 board with 8 GPUs, 1,312 kgCO2e, share of each component
Manufacture of an AI server, by component
Sources
Source: Nvidia, HGX H100 Product Carbon Footprint. projetcelsius.com/en/ai · CC BY 4.0
The analysis
- Memory accounts for 42% of manufacturing: it is the largest item, ahead of the compute chips.
- The next generation, the HGX B200, weighs 2,274 kgCO2e, 1.7 times more, of which 49% for memory.
- Over its lifetime, an AI server emits far more through its electricity than through its manufacture; the order is reversed for metals.
The figures
- Memory: 42 %.
- Integrated circuits: 25 %.
- Cooling: 18 %.
- Assembly: 9 %.
- Electromechanical: 4 %.
- Other: 3 %.
Assumptions
- Manufacturing, from cradle to factory gate, excluding use.
- A data sheet published by the manufacturer itself.
- The complete server (processors, storage, chassis) and the building are not included.
Continue with hardware
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HardwareTraining emissions, 4 published assessments20timesthe emissions of GPT-3, for Llama 3.1ChartHardwareThe footprint of digital devices99%of a smartphone's footprint comes from its manufactureChartHardwareElectronic waste and AI22.3%of 2022 electronic waste collected and recycledChartHardwareLife cycle assessment of Mistral Large 261%for materials, the manufacture of servers and chips
HardwareTraining emissions, 4 published assessments20timesthe emissions of GPT-3, for Llama 3.1ChartHardwareThe footprint of digital devices99%of a smartphone's footprint comes from its manufactureChartHardwareElectronic waste and AI22.3%of 2022 electronic waste collected and recycledChartHardwareLife cycle assessment of Mistral Large 261%for materials, the manufacture of servers and chipsOn the Projet Celsius blog ↗
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